On April 1st, news reported that the Japanese chip manufacturer Rapidus announced that the company...Plan to launch the pilot production line within this month based on the installed front-end equipment.Implement the commissioning of EUV machines and continue to introduce other equipment to advance the development of 2nm GAA advanced process technology.

Rapidus will be within this fiscal year (ending next March 31).Publishing the 2nm node PDK to early access customers(Process Design Kit) to prepare for the completion of the pilot line, chip verification, and eventual mass production for the fiscal year 2027.

In terms of advanced packaging, the company plans to launch a pilot production line project to further develop the required RDL (Redistribution Layer), 3D packaging technology, and KGD (Known Good Die) screening technology, as well as to build a packaging assembly design kit (ADK) for customers.

▲ Rapidus IIM Wafer Fab, photographed on March 27

Japan's Ministry of Economy, Trade and Industry approved locally yesterdayFunding Plan for Rapidus in Fiscal Year 2025The front-end and back-end processes were allocated a maximum of 675.5 billion yen and 127 billion yen, respectively, totaling 802.5 billion yen (approximately 38.932 billion yuan at the current exchange rate). The cumulative amount over multiple years reached 1.7225 trillion yen.